3C industry
Coating Equipment

Product Introduction
The equipment features multiple arc and sputtering targets, including HiPIMS, allowing for separate coatings using arc or magnetron sputtering or a combination of both to optimize the coating process. High-energy particles from the arc are employed to clean the substrate and enhance film-substrate bonding at the initial stage, followed by medium-frequency sputtering to produce a delicate, smooth coating. Additionally, the device can incorporate an ion source to accommodate multifunctional coating requirements, enabling the creation of single metal films or composite multilayer films tailored for the aesthetic needs of 3C digital products.
Key Features
Diverse Sedimentation Methods: Offers a range of coating techniques for versatility.
Aesthetic Appeal: Produces beautiful coatings with a delicate surface that is wear-resistant and non-fading.
High Productivity: Ensures efficient output to meet production demands.
Flexible Material Targeting: Capable of depositing multiple material targets with high flexibility.
Multicolor Process Support: Provides support for multi-color processes and new color development.
Key Specs
Device model | SP-1212ASI | SP-1512ASI | SP-1618ASI | SP-1912ASI |
Vacuum chamber size (mm) | 1200x1200 | 1500x1200 | 1600x1800 | 1900x1200 |
Coat Color | White Chrome, Gold Chrome, Champagne Gold, Rose Gold, Coffee Color, Gun Black, Black, Etc. | |||
Maximum vacuum | 6.0E-4Pa | |||
Air Extraction Time | Ambient Pressure to 5.0E-Pa in less than 15 mins | |||
Pressure Rise Rate | 1h≤0.5Pa | |||
Vacuum Pump Set | Mechanical pump, Roots pump, Molecular Pump.Maintaining Pump | |||
Heating System | Room temperature to 300℃ (PID controlled).heated by stainless steel heating tubes | |||
Air injection system | Mass flow controller (1-4 set) | |||
Targets | Circular Target, Pillar Target, Plane Target, MF Twin Pillar Target, Linear lon Source | |||
Power Supply | MF Sputtering Power Supply, HiPIMS Power Supply, Arc Power Supply, High Voltage Bombardment Bias Power Supply.DC Sputtering Power Supply, lon Source Power | |||
Workpiece Rotation Method | Planetary Movement(1-5RPM) | |||
Operating Method | Manual+semi-Automatic+Fully Automatic+PLC+IPC | |||
Note | Specifications can be fully customized according to customer's product and recipe requirements | |||
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